发明名称 |
POWER SEMICONDUCTOR MODULE |
摘要 |
Disclosed herein is a power semiconductor module including a module housing comprising an accommodation space formed therein and fixing portions formed on an external surface thereof, a printed circuit board included in the module housing, exposed through the accommodation space, and comprising circuit patterns (Cu patterns) on which power devices are arranged, and a terminal fixedly coupled to the fixing portion, and comprising an input end for receiving power and leads adhered to a circuit pattern between the power devices and for distribution of supplied current. Accordingly, stray inductance may be effectively reduced, and thus, current distribution between power devices may be balanced, thereby effectively preventing a surge voltage from increasing. |
申请公布号 |
US2015156909(A1) |
申请公布日期 |
2015.06.04 |
申请号 |
US201414270167 |
申请日期 |
2014.05.05 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Kwak Young Hoon;Hong Chang Seob;Lee Young Ki |
分类号 |
H05K7/14 |
主分类号 |
H05K7/14 |
代理机构 |
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代理人 |
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主权项 |
1. A power semiconductor module:
a module housing comprising an accommodation space formed therein and fixing portions formed on an external surface thereof; a printed circuit board included in the module housing, exposed through the accommodation space, and comprising circuit patterns (Cu patterns) on which power devices are arranged; and a terminal fixedly coupled to the fixing portion, and comprising an input end for receiving power and leads adhered to a circuit pattern between the power devices and for distribution of supplied current. |
地址 |
Suwon-Si KR |