| 发明名称 |
LAMINATED SUBSTRATE AND METHOD OF MANUFACTURING LAMINATED SUBSTRATE |
| 摘要 |
A method of manufacturing a laminated substrate, the method includes: forming a first diameter hole to a first surface of a first substrate so as not to penetrate the first substrate; forming a second diameter hole to a second surface of the first substrate so as to communicate with the first diameter hole; plating the first substrate to block the second diameter hole without blocking the first diameter hole; and laminating a second substrate on the second surface of the first substrate. |
| 申请公布号 |
US2015156874(A1) |
申请公布日期 |
2015.06.04 |
| 申请号 |
US201414470022 |
申请日期 |
2014.08.27 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
HASEGAWA Takumi;FUJISAKI Hidehiko |
| 分类号 |
H05K1/11;H05K1/14;H05K3/00 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a laminated substrate, the method comprising:
forming a first diameter hole to a first surface of a first substrate so as not to penetrate the first substrate; forming a second diameter hole to a second surface of the first substrate so as to communicate with the first diameter hole; plating the first substrate to block the second diameter hole without blocking the first diameter hole; and laminating a second substrate on the second surface of the first substrate. |
| 地址 |
Kawasaki-shi JP |
