PHOTOSENSITIVE RESIN ELEMENT

摘要

Provided is a photosensitive element which has an aesthetic appearance, long product life, and which reduces defects caused by resist chips in the lamination step when fabricating printed circuit boards. This photosensitive resin element contains a support layer and a photosensitive resin layer on top of said support layer. The photosensitive resin layer contains: (a) a binder resin having a carboxyl group content of 100-600 (acid equivalent), and a weight-average molecular weight of 5,000-500,000; (b) a photopolymerizable unsaturated compound; (c) a photopolymerization initiator; and (d) a solvent. The photosensitive resin layer contains 0.001 mass % to 1 mass % of the solvent (d) with reference to the mass of the photosensitive resin layer, and the photosensitive resin layer contains at least one compound selected from general formulae (I) to (III) as (b) the polymerizable unsaturated compound.