| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting device including a sub-mount structure acting effectively for further enhancement of luminous efficiency, enhancement of productivity and cost reduction, and ensuring the stability of bonding.SOLUTION: A chip-on-board (COB) light-emitting device includes a substrate, a sub-mount arranged on the substrate and having one principal surface and the other principal surface, a light-emitting element arranged on the one principal surface, and a first recess in the other principal surface stretching in a first direction. The recess is formed in a region of the other principal surface where the light-emitting element is not arranged, and the opening width of the recess is smaller than the width constituted by the recess and an adjacent recess. |
