| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board small in warp. ! SOLUTION: A printed wiring board comprises: a resin insulator layer; a conductor layer formed on each front and rear sides of the resin insulator layer; and a via conductor connecting between the front and rear conductor layers. The resin insulator layer has a piece of glass cloth, of which the Young's modulus is 9.0 Gpa or larger, the breaking strength is 160 Mpa or larger, the elongation percentage is 1.8% or larger, Tg (glass transition point) is 155 degrees or higher, and CTE (coefficient of thermal expansion) is 30 ppm or less. ! COPYRIGHT: (C)2015,JPO&INPIT |
