Electronic Device

摘要

An electronic device includes wiring substrates stacked upon one another with a connection member arranged between adjacent wiring substrates, in which the connection member electrically connects the adjacent wiring substrates, and each wiring substrate includes a solder resist layer as a lowermost layer, electronic components mounted on the wiring substrates so that at least one of the electronic components is mounted on each wiring substrate, a first magnetic thin film covering a lower surface of the solder resist layer of an upper one of the adjacent wiring substrates, a first encapsulation resin formed on an upper surface of the uppermost wiring substrate and encapsulates the electronic component mounted on the uppermost wiring substrate, and a second magnetic thin film that entirely covers an upper surface of the first encapsulation resin and covers a lower surface of the solder resist layer on the lowermost wiring substrates.

主权项

1. An electronic device comprising:
a plurality of wiring substrates stacked upon one another with a connection member arranged between adjacent ones of the wiring substrates, wherein the connection member electrically connects the adjacent ones of the wiring substrates, and each of the wiring substrates includes a solder resist layer as a lowermost layer; a plurality of electronic components mounted on the wiring substrates so that at least one of the electronic components is mounted on each of the wiring substrates; a first magnetic thin film that covers a lower surface of the solder resist layer of an upper one of the adjacent ones of the wiring substrates; a first encapsulation resin formed on an upper surface of the uppermost one of the wiring substrates, wherein the first encapsulation resin encapsulates the electronic component mounted on the uppermost one of the wiring substrates; and a second magnetic thin film that entirely covers an upper surface of the first encapsulation resin and covers a lower surface of the solder resist layer on the lowermost one of the wiring substrates.