INTEGRATED OPTOELECTRONIC MODULE

摘要

An integrated module includes a first component having a photonic device and electrical pads at a first side and a second side opposite to the first side, and a second component having electrical pads and bonded to the first component by matching their electrical pads. An optical signal is incident from an external medium to the photonic device through an anti-reflection coating at the second side of the first component, a partially-etched opening, or an etch-through opening. The opening can either be in the first component so the optical signal is incident at the photonic device from the second side or the opening can be in the second component so the optical signal is incident at the photonic device through part of the second component. When bonding the first component to the second component, a protrusion and indentation pair can be used to increase the alignment accuracy.

主权项

1. An integrated module, comprising:
a first component having a photonic device and electrical pads at a first side and an anti-reflection coating layer at a second side opposite to the first side, a second component having electrical pads at a first side and a second side opposite to the first side, an optical signal is incident from an external medium at the second side of the first component, wherein the first side of the first component is bonded to the first side of the second component by aligning at least one of the electrical pad from each component.