| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation substrate capable of solving the problem of increase in overall thickness in conventional heat dissipation substrates caused by adding heat dissipation fins.SOLUTION: A heat dissipation substrate includes a heat sink, a metal base, and an elastic structure. The heat sink includes a carrying portion and supporting portions. The supporting portions are parallel to one another and disposed on a lower surface of the carrying portion. The supporting portions are perpendicular to the carrying portion and surround an accommodating space with the carrying portion. The carrying portion has a first rough surface structure disposed on a part of the lower surface and the first rough surface structure is located in the accommodating space. The metal base is disposed below the heat sink and has a mounting surface and a second rough surface structure disposed on a part of the mounting surface and corresponding to the first rough surface structure. The first and second rough surface structures and the supporting portions define a fluid chamber in which the elastic structure is disposed, and a working fluid flows in the fluid chamber. |
