发明名称 ETCHANT COMPOSITION AND ETCHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an etchant composition and an etching method, allowing a thin line having a desired width even when the copper concentration in an etchant rises in one-time etching of a laminate film consisting of a titanium-based film and a copper-based film. ! SOLUTION: The etchant composition of the present invention is an etchant composition for one-time etching of a laminate film consisting of a titanium based film and a copper-based film and is characterized by consisting of an aqueous solution comprising (A) a hydrogen peroxide; (B) a fluoride ion source; (C) a phosphono butane tricarboxylic acid or a salt thereof; and (D) at least one or more compounds selected from azole-based compounds and compounds having, in the structure, a heterocyclic six-membered ring comprising one or more nitrogen atoms and having three double bonds. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015101778(A) 申请公布日期 2015.06.04
申请号 JP20130244923 申请日期 2013.11.27
申请人 ADEKA CORP 发明人 ISHIZAKI JUNRO
分类号 C23F1/18;C23F1/26;H01L21/308 主分类号 C23F1/18
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