ELECTRONIC DEVICE COMPRISING A CHIP OF INTEGRATED CIRCUITS STACKED WITH AN OPTICAL PLATE

摘要

An electronic device is formed by a stack of an integrated circuit chip and an optical plate. The integrated circuit chip includes integrated circuits (such as optical circuits) formed on or in a semiconductor substrate plate. The optical integrated circuits may form an optical sensor. An electrical connection network is provided on the top side of the semiconductor substrate plate. Electrical connection lugs, which are connected to the electrical connection network through electrical connection vias, are mounted on the back side of the semiconductor substrate plate. The vias are through silicon vias situated at a distance from the periphery of the semiconductor substrate plate. The optical plate is configured to allow light radiation to pass to the optical integrated circuits.

主权项

1. An electronic device comprising, in a stack:
a chip of integrated circuits which comprises a substrate plate including an optical sensor and an electrical connection network, said substrate plate having, on a first side, first electrical connection lugs connected to the electrical connection network through electrical connection vias situated at a distance from a periphery of the substrate plate, an optical plate configured to allow light radiation to pass which is mounted to a second side of the chip opposite to the first side; and an encapsulation ring made of an opaque encapsulation material surrounding said chip and said optical plate.