发明名称 |
MECHANISMS FOR FORMING IMAGE SENSOR DEVICE |
摘要 |
Embodiments of mechanisms for forming an image sensor device are provided. The image sensor device includes a semiconductor substrate and a photodetector in the semiconductor substrate. The image sensor device also includes a dielectric layer over the semiconductor substrate, and the dielectric layer has a recess aligned with the photodetector. The image sensor device further includes a filter in the recess of the dielectric layer. In addition, the image sensor device includes a shielding layer between the dielectric layer and the semiconductor substrate and surrounding the filter. |
申请公布号 |
US2015155320(A1) |
申请公布日期 |
2015.06.04 |
申请号 |
US201314093277 |
申请日期 |
2013.11.29 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHIEN Volume;CHENG Yun-Wei;JANGJIAN Shiu-Ko;LIU Zhe-Ju;LEE Kuo-Cheng;JENG Chi-Cherng |
分类号 |
H01L27/146;H01L31/0216;H01L31/0232 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
1. An image sensor device, comprising:
a semiconductor substrate; a photodetector in the semiconductor substrate; a dielectric layer over the semiconductor substrate, wherein the dielectric layer has a recess aligned with the photodetector; a filter in the recess of the dielectric layer; and a shielding layer between the dielectric layer and the semiconductor substrate and surrounding the filter. |
地址 |
Hsin-Chu TW |