发明名称 MECHANISMS FOR FORMING IMAGE SENSOR DEVICE
摘要 Embodiments of mechanisms for forming an image sensor device are provided. The image sensor device includes a semiconductor substrate and a photodetector in the semiconductor substrate. The image sensor device also includes a dielectric layer over the semiconductor substrate, and the dielectric layer has a recess aligned with the photodetector. The image sensor device further includes a filter in the recess of the dielectric layer. In addition, the image sensor device includes a shielding layer between the dielectric layer and the semiconductor substrate and surrounding the filter.
申请公布号 US2015155320(A1) 申请公布日期 2015.06.04
申请号 US201314093277 申请日期 2013.11.29
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 CHIEN Volume;CHENG Yun-Wei;JANGJIAN Shiu-Ko;LIU Zhe-Ju;LEE Kuo-Cheng;JENG Chi-Cherng
分类号 H01L27/146;H01L31/0216;H01L31/0232 主分类号 H01L27/146
代理机构 代理人
主权项 1. An image sensor device, comprising: a semiconductor substrate; a photodetector in the semiconductor substrate; a dielectric layer over the semiconductor substrate, wherein the dielectric layer has a recess aligned with the photodetector; a filter in the recess of the dielectric layer; and a shielding layer between the dielectric layer and the semiconductor substrate and surrounding the filter.
地址 Hsin-Chu TW