SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLID-STATE IMAGING APPARATUS

摘要

A solid-state imaging apparatus includes a first substrate that includes a plurality of photoelectric conversion units, a second substrate that includes at least a part of a readout circuit configured to read signals based on electric charges of the plurality of photoelectric conversion units and a peripheral circuit including a control circuit, and a wiring structure that is disposed between the first substrate and the second substrate and includes a pad portion electrically connected to the peripheral circuit via a draw-out wiring and an insulating layer. The wiring structure has, at least at a part thereof, a seal ring disposed in such a way as to surround the photoelectric conversion units and the peripheral circuit.

主权项

1. A solid-state imaging apparatus that includes a plurality of pixels each of which includes a photoelectric conversion unit and a peripheral circuit configured to read signals from the plurality of pixels,
wherein the plurality of photoelectric conversion units are disposed in a first member, and the peripheral circuit are disposed in a second member, and the first member and the second member are bonded in such a way that a signal from the pixel can be received by the peripheral circuit disposed in the second member, the solid-state imaging apparatus comprising: a sealing portion, wherein the sealing portion includes a first sealing portion disposed in the first member and a second sealing portion disposed in the second member, and a part of the first sealing portion is in contact with a part of the second sealing portion.