| 发明名称 |
SUBSTRATE TREATING APPARATUS AND METHOD |
| 摘要 |
Provided is a substrate treating apparatus. The substrate treating apparatus includes a process chamber in which a predetermined process is performed on a substrate, a pressure meter measuring a pressure within the process chamber, and a controller receiving the measured pressure value from the pressure meter to determine an opening time of the process chamber. The controller opens the process chamber when a set condition elapses from a time at which the pressure within the process chamber reaches a preset opening pressure. |
| 申请公布号 |
US2015155188(A1) |
申请公布日期 |
2015.06.04 |
| 申请号 |
US201414556380 |
申请日期 |
2014.12.01 |
| 申请人 |
SEMES CO., LTD. |
发明人 |
Jung In-II;Kim Woo-Young;Lee Young il;Kim Boong |
| 分类号 |
H01L21/67;B08B7/00;F26B21/10;H01J37/32 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate treating apparatus comprising:
a process chamber in which a predetermined process is performed on a substrate; a pressure meter measuring a pressure within the process chamber; and a controller receiving the measured pressure value from the pressure meter to determine an opening time of the process chamber, wherein the controller opens the process chamber when a set condition elapses from a time at which the pressure within the process chamber reaches a preset opening pressure. |
| 地址 |
Chungcheongnam-do KR |
