SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME

摘要

A semiconductor manufacturing apparatus may include a chamber accommodating a substrate to be processed, a first electrode providing electric field in the chamber and a second electrode opposing to the first electrode, and a first power transmitting rod connected to one of the first electrode and the second electrode. A conductive stress attenuating unit may be formed in the first power transmitting rod. Methods of manufacturing semiconductor devices using the semiconductor manufacturing apparatus are also disclosed.

主权项

1. A semiconductor manufacturing apparatus comprising:
a chamber; a first electrode formed in the chamber; a second electrode opposite the first electrode; and a first power transmitting rod connected to one of the first electrode and the second electrode, the first power transmitting rod having one end portion and another end portion, wherein, a first conductive stress attenuating unit is formed between the one end portion and the other end portion of the first power transmitting rod.