发明名称 MULTILAYER ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND BOARD HAVING THE SAME MOUNTED THEREON
摘要 A multilayer electronic component, a manufacturing method thereof, and a board having the same. The multilayer electronic component includes a plurality of magnetic metal layers, an internal conductive layer formed on the magnetic metal layer, an upper and lower cover layers formed on and below an active part including the plurality of magnetic metal layers and internal conductive layer. The multilayer electronic component may have excellent DC bias characteristics by using a magnetic metal material, implement low direction resistance (Rdc) by increasing a cross-sectional area of an internal coil, and secure high magnetic permeability while decreasing a core loss of the magnetic metal material to thereby improve efficiency characteristic.
申请公布号 US2015155084(A1) 申请公布日期 2015.06.04
申请号 US201414289025 申请日期 2014.05.28
申请人 Samsung Electro-Mechanics Co., Ltd. 发明人 KIM Ic Seob;SON Soo Hwan;CHOI Yu Jin;KIM Ho Yoon;KIM Myeong Gi;SONG So Yeon;CHEON Min Kyoung;MOON Byeong Cheol;LEE Young Il
分类号 H01F1/147;H01F41/04;H05K1/11;H05K1/18;H01F27/255;H01F27/28 主分类号 H01F1/147
代理机构 代理人
主权项 1. A multilayer electronic component comprising: a plurality of magnetic metal layers; and an internal conductive layer disposed on the magnetic metal layer, wherein the internal conductive layer includes an internal coil pattern part and a negative printed part, in a cross-section of the negative printed part, the amount of particles having a long-axis length of about 5 μm or less being about 65% to 70% of the entire amount of particles, and the amount of particles having a long-axis length of about 10 μm to about 20 μm being about 8% to about 12% of the overall amount of particles.
地址 Suwon KR
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