发明名称 Low-Melt Poly(Amic Acids) and Polyimides and their Uses
摘要 Provided are low-melt polyimides and poly(amic acids) (PAAs) for use in repair of electrical wire insulation, flat or ribbon wire harnesses, and flat surfaces comprised of high-performance polymers such as inflatables or solar panels applications. Also provided are methods and devices for repair of electrical insulation.
申请公布号 US2015155071(A1) 申请公布日期 2015.06.04
申请号 US201314093701 申请日期 2013.12.02
申请人 United States of America as Represented by the Administrator of the National Aeronautics and Spac 发明人 Jolley Scott T.;Gibson Tracy L.;Williams Martha K.;Parrish Clyde F.;Parks Steven L.
分类号 H01B3/30;H01B13/00;H01B13/06 主分类号 H01B3/30
代理机构 代理人
主权项 1. A wire insulation repair wrap comprising a poly(amic acid) (PAA) or a polyimide having reactive end groups, or a polyimide comprising polyether blocks or polysiloxane blocks; wherein the wrap is adapted to patch or surround an electrical wire having a layer of polyimide insulation, so as to repair damage to the insulation layer.
地址 Washington DC US