ZINC-BASED LEAD-FREE SOLDER COMPOSITIONS

摘要

Electronic packaging arrangements having lead-free solders are disclosed. In particular, lead-free solder compositions and lead frame constructs for use therewith are disclosed. The lead-free solder compositions may be zinc-based and may include zinc, aluminum, and germanium as major components and gallium and magnesium as minor components. The lead-free, zinc-based solder compositions may exhibit desirable melting properties, mechanical properties, and wetting properties, for example.

主权项

1. A solder composition comprising:
zinc as a first major component; aluminum as a second major component; germanium as a third major component; gallium as a first minor component; and magnesium as a second minor component; wherein each of the minor components is present in the solder composition in an amount less than each of the major components.