OPTOELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

摘要

The invention relates to a method for producing an optoelectronic component (100) comprising a leadframe (110) embedded in a shaped body (130) and an optoelectronic semiconductor chip (140) arranged on a top side (113) of the leadframe (110). This involves providing a leadframe (110). A further step involves carrying out an etching step in which, on the top side (113) of the leadframe (110), at least one trench structure (120) is produced in the leadframe (110). Furthermore, a shaped body (130) is produced by the leadframe (110) being encapsulated with a molding material by injection molding. Furthermore, the optoelectronic semiconductor chip (140) is arranged on the top side (113) of the leadframe (110), wherein the at least one trench structure (120) is used as an alignment mark for aligning the optoelectronic semiconductor chip (140) on the leadframe (110).