| 摘要 |
A novel semiconductor chip scale package encapsulates a semiconductor chip on the device side, the non-device side, and the four edges with a mold compound. One process to fabricate such a semiconductor chip scale package involves forming trenches on the surface of a wafer around the chips and filling the trenches and covering the device side of the chips with a first mold compound. The wafer is subsequently thinned from the non-device side until the bottom portion of the trenches and the mold compound in the portion are also removed. The thinning process creates a plane that contains the back side of the chips and the mold compound exposed in the trench. This plane is subsequently covered with a second mold compound. |
