SEALING THERMOSETTING-RESIN SHEET AND HOLLOW-PACKAGE MANUFACTURING METHOD

摘要

This invention provides a sealing thermosetting-resin sheet and a hollow-package manufacturing method whereby it is difficult for the material constituting said sealing thermosetting-resin sheet to flow into gaps between an adherend and an electronic device. This invention pertains to a sealing thermosetting-resin sheet that is used to manufacture a hollow package. When cured, said sealing thermosetting-resin sheet has a domain-matrix structure comprising a matrix part consisting primarily of a first resin component and domain parts consisting primarily of a second resin component, with the matrix part being softer than the domain parts.