THE MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

摘要

The present invention relates to a method for manufacturing a printed circuit board. The method for manufacturing the printed circuit board according to the present invention includes the steps of: preparing a base material with a photosensitive resist layer on one side thereof; removing a conductive pattern formation region from the photosensitive resist layer by exposing and developing the conductive pattern formation region; forming a conductive pattern by filling the removed region of the photosensitive resist layer with conductive ink; and removing the photosensitive resist layer. Accordingly, the electrical property and the implementation precision of a circuit pattern are improved in comparison with an existing circuit pattern. The electrical property and the reliability are improved by removing the remaining metallic materials on the base material. An environment contamination due to an etchant is prevented and the number of manufacturing processes is reduced by forming the conductive pattern without an etching process. Provided is the method for manufacturing a printed circuit board without a disconnection due to thermal or physical impacts and the curve and bend of the double-sided printed circuit board.