| 摘要 |
PROBLEM TO BE SOLVED: To provide a method capable for reliably forming a device chip on the rear face of which a die-bonding adhesive layer is laminated. ! SOLUTION: A device chip forming method for forming a device chip on the rear face of which a die-bonding adhesive layer is laminated includes: a step of locating a mask on a rear face of a wafer so that a region corresponding to a device 15 is aligned with an opening 14 of a mask 12 on the rear face of a device wafer 11, coating a region corresponding to a split schedule line 13 with the mask, and exposing a region corresponding to the device via an opening; a step of applying a die-bonding adhesive 18 to the rear face of the wafer via the mask, and forming the die-bonding adhesive layer on a region corresponding to the device on the rear face; a step of removing the mask; and a split step of forming plural device chips on the rear face of which the die-bonding adhesive layer is laminated by splitting the device wafer along the split schedule line. ! C |
