METHOD FOR PRODUCING OPTOELECTRONIC COMPONENTS FOR ENCAPSULATING LAYERS

摘要

The invention relates to a method for producing optoelectronic components for encapsulating layers. For this purpose, a support (1) with a support main face (10) is provided. A mask (2) is applied onto the support main face (10) of the support (1). The mask (2) has a first mask layer (21) and a second mask layer (22). The mask (2) further has at least one through-hole (200) which completely passes through the mask (2) in a direction perpendicular to the support main face (10). Moreover, the first mask layer (21) has at least one undercut (201) with respect to the second mask layer (22) in the region of the through-hole (200). A functional material (4) is deposited after the mask (2) has been applied onto the support (1) such that at least one material structure (41) which is arranged on the support main face (10) is produced in the region of the through-hole (200). An encapsulation layer (5) is then deposited on at least the material structure (41). The encapsulation layer (5) is deposited such that exposed faces of the material structure (41) are completely covered by the encapsulation layer (5) before the encapsulation layer (5) is applied. In an additional step, the mask (2) is removed after the encapsulation layer (5) has been applied.