| 摘要 |
A method for producing a semiconductor device which involves: forming a device region (17) in a center section of a semiconductor wafer (2); forming a ring-shaped reinforcing section (18), which is thicker than the device region (17), along the outer circumference of the device region (17); subjecting the semiconductor wafer (2) to a wet treatment after forming the device region (17) and the ring-shaped reinforcing section (18); rotating and drying the semiconductor wafer (2) after performing the wet treatment (2); and positioning the center position of the semiconductor wafer (2) and the center position of the ring-shaped reinforcing section (18) so as to be different. |
