| 发明名称 |
UNDERFILL COMPOSITION |
| 摘要 |
The present invention provides a composition which does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to an underfill sealant composition comprising (a) a (meth)acrylic compound and (c) an isocyanuric acid having an allyl group. |
| 申请公布号 |
EP2755233(A4) |
申请公布日期 |
2015.06.03 |
| 申请号 |
EP20120830373 |
申请日期 |
2012.09.07 |
| 申请人 |
HENKEL AG & CO. KGAA |
发明人 |
HORIGUCHI, YUSUKE;SANO, MIEKO;SATO, KENICHIRO |
| 分类号 |
H01L21/60;C08F220/10;C08F220/26;C08F222/40;C08F226/06;C09D4/06;C09D135/00;H01L23/29;H01L23/31 |
主分类号 |
H01L21/60 |
| 代理机构 |
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