发明名称 |
Method of filling through-holes |
摘要 |
The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing reaction products of aromatic heterocyclic nitrogen compounds and epoxy-containing compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using a copper electroplating bath which includes additives such as brighteners and levelers. |
申请公布号 |
EP2778260(A3) |
申请公布日期 |
2015.06.03 |
申请号 |
EP20140159759 |
申请日期 |
2014.03.14 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
JAYARAJU, NAGARAJAN;NAJJAR, ELIE H.;BARSTAD, LEON R. |
分类号 |
C25D3/38;C25D5/02;C25D5/10;C25D5/34;H05K3/00 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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