| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a film excellent in a wiring embedding property, and excellently formable of a conductor layer by electroless plating while keeping a surface roughness small, and to provide a resin composition giving a cured product. <P>SOLUTION: The resin composition contains a thermosetting resin (A), a spherical surface-treated silica (B) having an average particle diameter of 5μm or smaller and preliminarily surface-treated by a surface-treating agent X that has a functional group that can react with the thermosetting resin (A), and a spherical untreated silica (C) having an average particle diameter smaller than the surface-treated silica (B) and not surface-treated by the surface-treating agent X. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
