发明名称 |
METHOD FOR PLATING RF EQUIPMENT AND RF EQUIPMENT MANUFACTURED THEREFROM |
摘要 |
<p>A plating method for an RF device is disclosed. The method includes (a) pre-treating the RF device made from a substrate material; (b) forming a copper plating layer by applying copper plating to the RF device; and (c) forming a thin-film layer over the copper plating layer, the thin-film layer made of a precious metal, where a thickness of the precious-metal thin-film layer is thinner than a skin depth at a working frequency band. The disclosed method makes it possible to provide a plating treatment with a low cost while providing a superior appearance quality.</p> |
申请公布号 |
EP2261399(B1) |
申请公布日期 |
2015.06.03 |
申请号 |
EP20090715938 |
申请日期 |
2009.02.27 |
申请人 |
ACE TECHNOLOGIES CORP. |
发明人 |
JUNG, HYUN-YEONG;JUNG, MYOUNG-JOON |
分类号 |
C25D5/10;C25D3/38;C25D5/44;C25D7/00 |
主分类号 |
C25D5/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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