发明名称 |
CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF |
摘要 |
<p>The present invention relates to a chip electronic component and a manufacturing method thereof, and more specifically, to a chip electronic component which can implement an inner coil structure with a high aspect ratio (AR) by preventing short between coils and increasing the width in comparison with the height of the coil, and to a manufacturing method thereof. The chip electronic component comprises: a magnetic body including an insulation substrate; an inner coil unit formed on at least one surface of the insulation substrate; and an external electrode formed on one cross section of the magnetic body and connected with the inner coil unit.</p> |
申请公布号 |
KR101525703(B1) |
申请公布日期 |
2015.06.03 |
申请号 |
KR20130158078 |
申请日期 |
2013.12.18 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
JEONG, DONG JIN;KIM, SUNG HOON;MIN, BYUNG SEUNG |
分类号 |
H01F17/00;H01F41/06 |
主分类号 |
H01F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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