| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic bonding device which increases bonding strength of an object to be bonded compared to conventional devices.SOLUTION: A ultrasonic device 10 is provided which includes a receiving section having a projection pattern block 31 and an ultrasonic vibration section 20 having a horn 21. The object to be bonded is welded by heat generated by friction due to ultrasonic vibration of the horn 21, while moving the projection pattern block 31 and the object to be bonded in the direction intersecting the vibration direction of the horn 21, with an object to be bonded interposed between the projection pattern block 31 and the horn 21. The projection pattern block 31 extends in the direction perpendicular to its moving direction. The shape of the horn 21 is such that the area of the horn 21 facing the projection pattern block 31 changes in accordance with the movement of the projection pattern block 31 along the extending direction of the projection pattern block 31. |
