发明名称 電子部品用パッケージと回路基板との接合構造
摘要 <p>An electronic component package has a base in the shape of a rectangle as viewed from the top, and a metal lid. A terminal electrode on a base bottom surface and a circuit substrate are joined using a conductive adhesive material. In the electronic component package, a first terminal electrode group including two or more terminal electrodes formed in parallel is formed eccentrically to one corner position of the base bottom surface, and a single second terminal electrode, or a second terminal electrode group including two or more terminal electrodes formed in parallel, is formed eccentrically only to a first diagonal position diagonally opposite the one corner position. Also, no-electrode regions in which no terminal electrode is formed along a short side of the base are provided at another corner position facing the one corner position in a short side direction of the base, and a second diagonal position diagonally opposite the other corner position. At least one of the terminal electrodes is a ground terminal electrode connected to the metal lid.</p>
申请公布号 JP5729457(B2) 申请公布日期 2015.06.03
申请号 JP20130258609 申请日期 2013.12.13
申请人 发明人
分类号 H01L23/04;H01L23/08;H03H9/02 主分类号 H01L23/04
代理机构 代理人
主权项
地址