发明名称 ガラス組成物、それを含むガラスフリット、それを含むガラスペースト、およびそれを利用した電気電子部品
摘要 <p>The present invention aims at providing a lead-free glass composition that can be soften and flowed at a firing temperature that is equal to or lower than that of conventional low melting point lead glass. Furthermore, the present invention aims at providing a lead-free glass composition having fine thermal stability and fine chemical stability in addition to that property. The lead-free glass composition according to the present invention is characterized by comprising at least Ag2O, V2O5 and TeO2 when the components are represented by oxides, wherein the total content ratio of Ag2O, V2O5 and TeO2 is 75 mass % or more. Preferably, the lead-free glass composition comprises 10 to 60 mass % of Ag2O, 5 to 65 mass % of V2O5, and 15 to 50 mass % of TeO2.</p>
申请公布号 JP5726698(B2) 申请公布日期 2015.06.03
申请号 JP20110213739 申请日期 2011.09.29
申请人 发明人
分类号 C03C8/08;C03C8/20;C03C8/24;H01J9/02;H01J9/24;H01J11/22;H01L23/02 主分类号 C03C8/08
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