Pressuring module, pressuring apparatus, and substrate bonding apparatus

摘要

The present invention relates to a pressuring apparatus comprising: a first surface; a second surface that opposes the first surface such that a plurality of semiconductor substrates is between the first surface and the second surface; a driving unit operable to move the first surface toward the second surface until the first surface reaches a predetermined position; and a pressing unit operable to deliver a pressing force to the first surface towards the second surface.