| 摘要 |
Provided in embodiments of the present disclosure is a cover assembly which includes a cover disposed between a device side surface of a substrate and a reflector plate, which are disposed within a thermal processing chamber. The presence of the cover between the device side surface of the substrate and the reflector plate has many advantages over conventional thermal processing chamber designs, which include an improved temperature uniformity during processing, a reduced chamber down time, and an improved cost-of-ownership of the processes performed in the thermal processing chamber. In some configurations, the cover includes two or more ports which are formed therein and are positioned to deliver gas from a space formed between the reflector plate and the cover to desired regions of the substrate during processing to reduce the temperature variation across the substrate. |
