发明名称 基板処理装置
摘要 <p><P>PROBLEM TO BE SOLVED: To prevent photo-corrosion of copper wiring and the like caused by radiation of light on a process target surface of a substrate, and, although the processible number of substrates decreases, allow processing such as cleaning that prevents photo-corrosion of copper wiring and the like caused by radiation of light in maintenance of a part of processing units in a substrate processing apparatus to be performed. <P>SOLUTION: A substrate processing apparatus comprises: a plurality of processing areas 30, 32, 34 in which a plurality of processing units 40a, 40b, 42a, 42b, 44a, 44b on which a light shielding treatment has been performed are arranged one above the other and housed inside; transfer areas 36, 38 housing carrier machines 46, 48 and provided between the processing areas; light shielding walls 50, 52 shielding light between the processing areas and the transfer areas; and maintenance doors 54b, 54d shielding front faces of the transfer areas from light. The processing units are linked to the light shielding walls in a light blocking state. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5726671(B2) 申请公布日期 2015.06.03
申请号 JP20110173704 申请日期 2011.08.09
申请人 发明人
分类号 H01L21/304 主分类号 H01L21/304
代理机构 代理人
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