发明名称 誘導結合プラズマ処理装置
摘要 An inductively coupled plasma processing apparatus performs plasma processing on a substrate by generating an inductively coupled plasma in a plasma generation region in a processing chamber. The apparatus includes a high frequency antenna for generating the inductively coupled plasma in the plasma generation region and a metal window provided between the plasma generation region and the high frequency antenna. The metal window is firstly divided into two or more sections electrically insulated from each other by a line along a peripheral direction of the metal window and then secondly divided into sections electrically insulated from each other by lines along directions crossing with the peripheral direction.
申请公布号 JP5727281(B2) 申请公布日期 2015.06.03
申请号 JP20110095154 申请日期 2011.04.21
申请人 東京エレクトロン株式会社 发明人 佐々木 和男;東条 利洋
分类号 H01L21/3065;H01L21/31;H05H1/46 主分类号 H01L21/3065
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