| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enable the use of a transport device holding the outer edge side of a plate like member and prevent stress from occurring in the supported plate like member. <P>SOLUTION: A support apparatus 10 includes: a table 12 having a support surface 11 supporting a semiconductor wafer W; movement regulation means 14 regulating movements of the semiconductor wafer W contacting with the support surface 11; and attachment/removal assisting means 15 blowing a gas over the semiconductor wafer W to assist attachment/removal of the semiconductor wafer W to/from the support surface 11. The gas is blown over the semiconductor wafer W transported by a transport device B to separate the semiconductor wafer W from the support surface 11. After the transport device B is withdrawn with the semiconductor wafer W being in the separation state, the semiconductor wafer W is suctioned and supported while contacting with the support surface 11. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
