METHOD AND DEVICE FOR STRESSING AN INTEGRATED CIRCUIT
摘要
Disclosed is in particular a device (2) for stressing an integrated circuit (1) including an electronic chip (10) mounted in a housing (12), the device including a source (20) of thermal stress. The device (2) also includes a thermally conductive coupling member (22), designed to be thermally coupled to the source (20) of thermal stress during the stressing operation. The coupling member (22) includes an end (220) whose geometry is suitable for being introduced into an aperture with a predefined geometry, to be made in the housing (12) of the integrated circuit (1) so as to thermally couple a coupling face (222) of this end (220) with a face (102) of the electronic chip (10).
申请公布号
EP2561373(B1)
申请公布日期
2015.06.03
申请号
EP20110715703
申请日期
2011.04.19
申请人
AIRBUS GROUP SAS;AIRBUS DEFENCE AND SPACE SAS
发明人
MOLIERE, FLORIAN;MORAND, SÉBASTIEN;DOUIN, ALEXANDRE;SALVATERRA, GÉRARD;BINOIS, CHRISTIAN;PEYRE, DANIEL