OPTICALLY CONNECTING A CHIP PACKAGE TO AN OPTICAL CONNECTOR
摘要
An optical communication module has an attachment feature for attachment to a chip package having an electrical-optical converter, the optical communication module to pass light communicated with an electrical-optical converter of the chip package. The optical communication module has an alignment feature to achieve a level of alignment with a system-side optical connector.
申请公布号
EP2877885(A1)
申请公布日期
2015.06.03
申请号
EP20120881801
申请日期
2012.07.27
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人
LEIGH, KEVIN B.;MEGASON, GEORGE D.;ROSENBERG, PAUL KESSLER