| 摘要 |
<p>According to the present invention, disclosed is a control system to make an electroplating solution which comprises: a circulation tank circulating and supplying plating solution to electroplate to a plating cell; a reaction tank reacting the plating solution supplied from the circulation tank with a metal piece, and re-inputting the plating solution to the circulation tank; a solution analyzer installed in a supply line to the reaction tank measuring sulfate ion concentration of the plating solution; a plating solution flow rate adjusting unit adjusting a flow rate of the plating solution supplied to the reaction tank; and a control unit applying a control signal to the plating solution flow rate adjusting unit based on an information related to a metal consumption received from a main controller of an electroplating line, and other information about the sulfate ion concentration received from the solution analyzer.</p> |
