| 摘要 |
<p>The present invention provides a substrate treating apparatus. The substrate treating apparatus includes a chamber in which a substrate treatment process is performed by providing a space to receive a substrate inside, a substrate transfer unit which includes a plurality of shafts which are arranged in parallel in a first direction to transfer the substrate and rotate and a plurality of rollers which are installed to rotate with the shaft on the outer circumference of each shaft and are in contact with the lower side of the substrate, a nozzle which sprays treatment solutions to the substrate which is transferred in the chamber, and a plate which is arranged under the upper side of the roller and induces the flow of the treatment solutions after the treatment solutions are completely treated on the substrate.</p> |
