发明名称 Graded composition encapsulation thin film comprising anchoring layer and method of fabricating the same
摘要 Disclosed herein is a graded composition encapsulation thin film and a fabrication method thereof. The encapsulation thin film comprises a substrate, a graded composition layer and an anchoring layer interposed therebetween. The anchoring layer serves to improve the adhesion between the graded composition layer and the substrate and creates advantageous conditions for the formation of the graded composition layer. Due to the presence of the anchoring layer, the encapsulation thin film has excellent barrier properties against the permeation of moisture and oxygen and is highly resistant to diffusion of other chemical species.
申请公布号 EP2109137(B1) 申请公布日期 2015.06.03
申请号 EP20080163171 申请日期 2008.08.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, YUN HYUK;LEE, KWANG HEE;BAE, HYUNG JIN;PARK, JONG JIN;BULLIARD, XAVIER
分类号 H01L23/31;H01L23/29;H01L51/52 主分类号 H01L23/31
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