POWER MODULE PACKAGE AND METHOD OF THE MANUFACTURING FOR THE SAME

摘要

The present invention relates to a power module package and a manufacturing method thereof. The power module package according to one embodiment of the present invention includes a first semiconductor device and a second semiconductor device which are mounted on one side of a first lead frame and one side of a second lead frame whose both ends are separated, respectively, a support pin which corresponds to the mounting position of the first semiconductor device and is formed in contact with the lower side of the first lead frame, and a molding part which covers the semiconductor device and a part of the lead frame.