Transient liquid phase bonding process for double sided power modules

摘要

A double-sided bonding process using transient liquid phase (TLP) bonding structure. A first side of an electronic device is processed to partially complete bonding. A second side of the electronic device is processed to complete bonding. The first side completes bonding during the processing of the second side. This reduces the time needed for the bonding process of both sides. This process allows for various TLP bonding parameters while being compatible with conventional fabrication systems.

主权项

1. A transient liquid phase (TLP) bonding method for double-sided bonding comprising:
placing a first bonding material between an electronic device and a first bonding objective, the first bonding material having a first solidification temperature and including a first material having a first melting point and a second material having a second melting point less than the first melting point; aligning the first bonding objective with a first side of the electronic device; starting a first bonding process by raising a temperature to the second melting point to melt the second material; interrupting the first bonding process by reducing the temperature before the second material is completely diffused; placing a second bonding material between the electronic device and a second bonding objective, the second bonding material having a second solidification temperature and including a third material having a third melting point and a fourth material having a fourth melting point less than the third melting point; aligning the second bonding objective with a second side of the electronic device opposite the first side; starting a second bonding process by raising the temperature to the second solidification temperature; completing the first bonding process during the second bonding process by forming a first bondline from the first bonding material; and completing the second bonding process by forming a second bondline from the second bonding material.