Integrated circuit package system employing wafer level chip scale packaging

摘要

An integrated circuit package system that includes: providing a substrate with a protective coating; attaching a labeling film to a support member in a separate process; joining the protective coating and the labeling film; and dicing the substrate, the protective coating, and the labeling film to form the integrated circuit package system.

主权项

1. An integrated circuit package system comprising:
a substrate with a first surface and a second surface, the second surface includes a polished surface for promoting adhesion of subsequent layers; electrical conductors on the first surface of the substrate; a protective coating directly on the second surface of the substrate, the protective coating is optically opaque, and the protective coating includes a coating material having high adhesion strength, durability, and temperature resistance for preventing delamination and for providing structural support for the substrate; and a labeling film on the protective coating, the labeling film includes a curable film having releasable bond properties, a sidewall of the protective coat coplanar to both a sidewall of the substrate and a sidewall of the labeling film.