发明名称 Heat dissipation device
摘要 A heat dissipation device includes a plurality of fins connected to each other and two heat pipes extending through the fins. Each fin includes a plate, an upper flange extending from a top side of the plate, a lower flange extending from a bottom side of the plate and an inner flange extending from an inner periphery of a groove defined in the plate. The fins include first fins and second fins having lengths larger than that of the first fins. The two heat pipes include a wide heat pipe and a narrow heat pipe. The wide heat pipe extends through the grooves and contacts the inner flanges of the first fins and the second fins. The narrow heat pipe extends through the grooves and contacts the inner flanges of the second fins.
申请公布号 US9046306(B2) 申请公布日期 2015.06.02
申请号 US201113216194 申请日期 2011.08.23
申请人 Foxconn Technology Co., Ltd. 发明人 Lin Chih-Hsun
分类号 H05K7/20;F28D15/02;F28F1/10;F28F1/32;H01L23/367;H01L23/427 主分类号 H05K7/20
代理机构 Novak Druce Connolly Bove + Quigg LLP 代理人 Novak Druce Connolly Bove + Quigg LLP
主权项 1. A heat dissipation device comprising: a plurality of fins connected to each other; a first heat pipe; and a second heat pipe having a heat conductivity smaller than that of the first heat pipe, the first heat pipe contacting more fins than the second heat pipe; wherein the plurality of fins comprise first fins and second fins different from the first fins; wherein each second fin has an area larger than that of the each first fin; wherein each second fin is longer than each first fin; wherein the first heat pipe contacts the first fins and the second fins, and the second heat pipe contacts the second fins but not the first fins; and wherein each of the first fins and the second fins comprises a plate defining a groove therein, the first heat pipe extending through the grooves of the first fins and the second fins, and the second heat pipe extending through the same grooves of the second fins.
地址 New Taipei TW