发明名称 Anti-viral member
摘要 Disclosed is an anti-viral member which can inactivate a virus. Specifically disclosed is an anti-viral member which is characterized by comprising a base material, univalent copper compound microparticles, and inorganic microparticles which are provided for the purpose of retaining the univalent copper compound microparticles on the base material and each of which has a silane monomer bound to the surface thereof via a chemical bond, wherein the inorganic microparticles are bound to one another via chemical bonds formed between the silane monomers provided on the surfaces thereof, and each of the inorganic microparticles is bound to the base material via a chemical bond between the silane monomer and the base material to form spaces in which the univalent copper compound microparticles are to be retained. The anti-viral member has an extremely high anti-viral activity compared to those achieved by the conventional binder immobilization techniques, and is applicable to various materials or various products to which the materials are applied.
申请公布号 US9045855(B2) 申请公布日期 2015.06.02
申请号 US200913142118 申请日期 2009.12.28
申请人 NBC Meshtec, Inc. 发明人 Fujimori Yoshie;Nakayama Tsuruo;Fukui Yoko
分类号 A01N25/08;D06M11/13;A61K39/42;A01N25/34;A01N59/20;D06M11/42;D06M11/53;D06M11/67;D06M13/188;D06M13/513;D06M16/00;D06M23/08 主分类号 A01N25/08
代理机构 Wenderoth, Lind & Ponack, L.L.P. 代理人 Wenderoth, Lind & Ponack, L.L.P.
主权项 1. An antiviral member, comprising: a substrate; univalent copper compound particles; and a group of inorganic particles which are for supporting the univalent copper compound particles on the substrate and which have a silane monomer chemically bonded to a surface thereof, wherein the inorganic particles having the silane monomer on the surface thereof are bonded to each other via chemical bonds formed between the silane monomers provided on the surface of the inorganic particles, and the group of inorganic particles are bonded to the substrate due to the chemical bonds between the silane monomers on the surface of the inorganic particles and the substrate, whereby the group of inorganic particles forms spaces for supporting the univalent copper compound particles.
地址 Tokyo JP