Dynamic current distribution control apparatus and method for wafer electroplating

摘要

Methods, systems, and apparatus for plating a metal onto a work piece are described. In one aspect, an apparatus includes a plating chamber, a substrate holder, an anode chamber housing an anode, and an ionically resistive ionically permeable element positioned between a substrate and the anode chamber during electroplating. The anode chamber may be movable with respect to the ionically resistive ionically permeable element to vary a distance between the anode chamber and the ionically resistive ionically permeable element during electroplating. The anode chamber may include an insulating shield oriented between the anode and the ionically resistive ionically permeable element, with opening in a central region of the insulating shield.

主权项

1. An apparatus comprising:
(a) a plating chamber configured to contain an electrolyte while electroplating metal onto a substrate; (b) a substrate holder configured to hold the substrate and having one or more electrical power contacts arranged to contact an edge of the substrate and to provide electrical current to the substrate during electroplating; (c) an ionically resistive ionically permeable element positioned between the substrate and an anode chamber during electroplating, the ionically resistive ionically permeable element having a flat surface that is substantially parallel to and separated from a plating face of the substrate; and (d) the anode chamber housing an anode, the anode chamber being movable with respect to the ionically resistive ionically permeable element to vary a distance between the anode chamber and the ionically resistive ionically permeable element during electroplating, the anode chamber including an insulating shield oriented between the anode and the ionically resistive ionically permeable element, wherein the insulating shield includes an outer perimeter and an inner perimeter, the inner perimeter of the insulating shield defining an opening in a central region of the insulating shield, and wherein a surface of the insulating shield includes a slope such that the outer perimeter is closer to the ionically resistive ionically permeable element than the inner perimeter, wherein the anode chamber includes a cationic membrane in the opening of the insulating shield.