Chip assembly and chip assembling method

摘要

A chip assembly includes a PCB and a chip positioned on the PCB. The PCB includes a number of first bonding pads. Each bonding pad includes two first soldering balls formed thereon. The chip includes a number of second bonding pads each corresponding to a first bonding pad. Each second bonding pad includes a second soldering ball. The two first soldering balls of a first bonding pad are electrically connected to the second soldering ball of a corresponding second bonding pad via two bonding wires.

主权项

1. A chip assembly comprising:
a PCB comprising a plurality of first bonding pads, each first bonding pad comprising two first soldering balls positioned thereon; and a chip positioned on the PCB, the chip comprising a plurality of second bonding pads, each second bonding pads corresponding to a respective one of the first bonding pads, each second bonding pad comprising a second soldering ball;wherein the two first soldering balls of each first bonding pad are electrically connected to the second soldering ball of a corresponding second bonding pad via two bonding wires.