Isolation rings for packages and the method of forming the same

摘要

A device includes a first package component, and a second package component underlying, and bonded to, the first package component. A molding material is disposed under the first package component and molded to the first and the second package components, wherein the molding material and the first package component form an interface. An isolation region includes a first edge, wherein the first edge of the isolation region contacts a first edge of the first package component and a first edge of the molding material. The isolation has a bottom lower than the interface.

主权项

1. A method comprising:
bonding a first package component with a second package component; molding the second package component in a molding material; forming a trench penetrating through the first package component, wherein the trench extends into the molding material; filling an isolation material into the trench to form an isolation region; and sawing through the isolation region and the molding material to form a package, wherein the package comprises a portion of the isolation region.